|
|
|
- Manufacture Wafer UV Dicing Tape For Semiconductor Cutting
- Descriptions: UV Dicing Tape an ultra-strong adhesion UV tape, specially designed for deep-cutting process of LED modules, QFN chips, camera modules, etc. It sustains a strong adhesion during dicing and can turn to very low adhesion after UV exposure, the
-
[Verified]
|
|
Negotiable
|